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Journal Articles

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology

Marek Kościelski, Janusz Sitek, Wojciech Stęplewski, Grazyna Kozioł, Piotr Ciszewski, Tomasz Krzaczek

Soldering & Surface Mount Technology (2015) 27 (3): 103–107.

https://doi.org/10.1108/SSMT-03-2015-0012

Published: 01 June 2015

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Journal Articles

Electrical and mechanical properties of RFID chip joints assembled on flexible substrates

Kamil Janeczek, Małgorzata Jakubowska, Grażyna Kozioł, Anna Młożniak

Soldering & Surface Mount Technology (2015) 27 (1): 13–21.

https://doi.org/10.1108/SSMT-02-2014-0004

Published: 02 February 2015

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Journal Articles

Mechanical durability of RFID chip joints assembled on flexible substrates

Kamil Janeczek, Tomasz Serzysko, Małgorzata Jakubowska, Grażyna Kozioł, Anna Młożniak

Soldering & Surface Mount Technology (2012) 24 (3): 206–215.

https://doi.org/10.1108/09540911211240074

Published: 22 June 2012

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