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Journal Articles

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Janusz Sitek, Marek Koscielski, Janusz Borecki, Tomasz Serzysko

Soldering & Surface Mount Technology (2017) 29 (1): 23–27.

https://doi.org/10.1108/SSMT-10-2016-0024

Published: 06 February 2017

View article titled, The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

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Journal Articles

Mechanical reliability of solder joints in PCBs assembled in surface mount technology

Janusz Borecki, Tomasz Serzysko

Soldering & Surface Mount Technology (2016) 28 (1): 18–26.

https://doi.org/10.1108/SSMT-10-2015-0037

Published: 01 February 2016

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Journal Articles

Mechanical durability of RFID chip joints assembled on flexible substrates

Kamil Janeczek, Tomasz Serzysko, Małgorzata Jakubowska, Grażyna Kozioł, Anna Młożniak

Soldering & Surface Mount Technology (2012) 24 (3): 206–215.

https://doi.org/10.1108/09540911211240074

Published: 22 June 2012

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