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Guang Meng
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Journal Articles
An alternative JEDEC test board design and analysis
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (3): 155–163.
Published: 21 June 2013
Journal Articles
Experimental investigation on the failure of lead‐free solder joints under drop impact
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (3): 36–41.
Published: 29 June 2010
