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Journal Articles

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Yansong Tan, Xin Li, Xu Chen, Zhenwen Yang, Guo-Quan Lu

Soldering & Surface Mount Technology (2020) 32 (3): 129–136.

https://doi.org/10.1108/SSMT-07-2019-0023

Published: 21 January 2020

View article titled, Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

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Journal Articles

Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

Yunhui Mei, Gang Chen, Xin Li, Guo‐Quan Lu, Xu Chen

Soldering & Surface Mount Technology (2013) 25 (2): 107–116.

https://doi.org/10.1108/09540911311309077

Published: 05 April 2013

View article titled, Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

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Journal Articles

Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

Xin Li, Gang Chen, Xu Chen, Guo‐Quan Lu, Lei Wang, Yun‐Hui Mei

Soldering & Surface Mount Technology (2012) 24 (2): 120–126.

https://doi.org/10.1108/09540911211214695

Published: 06 April 2012

View article titled, Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

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Journal Articles

Thermal fatigue behaviour of Al₂O₃-DBC substrates under high temperature cyclic loading

Guangcheng Dong, Xu Chen, Xinjian Zhang, Khai D.T. Ngo, Guo-Quan Lu

Soldering & Surface Mount Technology (2010) 22 (2): 43–48.

https://doi.org/10.1108/09540911011036280

Published: 13 April 2010

View article titled, Thermal fatigue behaviour of Al2O3-DBC substrates under high temperature cyclic loading

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Journal Articles

Edge tail length effect on reliability of DBC substrates under thermal cycling

Guangcheng Dong, Guangyin (Thomas) Lei, Xu Chen, Khai Ngo, Guo‐Quan Lu

Soldering & Surface Mount Technology (2009) 21 (3): 10–15.

https://doi.org/10.1108/09540910910970367

Published: 26 June 2009

View article titled, Edge tail length effect on reliability of DBC substrates under thermal cycling

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Journal Articles

Effect of interconnection area on shear strength of sintered joint with nano‐silver paste

Kun Qi, Xu Chen, Guo‐Quan Lu

Soldering & Surface Mount Technology (2008) 20 (1): 8–12.

https://doi.org/10.1108/09540910810861431

Published: 08 February 2008

View article titled, Effect of interconnection area on shear strength of sintered joint with nano‐silver paste

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Journal Articles

Strategies for improving the reliability of solder joints on power semiconductor devices

Guo‐Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata, John G. Bai

Soldering & Surface Mount Technology (2004) 16 (2): 27–40.

https://doi.org/10.1108/09540910410537309

Published: 01 August 2004

View article titled, Strategies for improving the reliability of solder joints on power semiconductor devices

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Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

Thermal fatigue behaviour of Al₂O₃-DBC substrates under high temperature cyclic loading

Edge tail length effect on reliability of DBC substrates under thermal cycling

Effect of interconnection area on shear strength of sintered joint with nano‐silver paste

Strategies for improving the reliability of solder joints on power semiconductor devices

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