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Journal Articles

Assembly issues with Sn/Ag/Cu bumped flip chips

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Sunil Gopakumar, Peter Borgesen, K. Srihari
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2007) 19 (4): 3–10.
https://doi.org/10.1108/09540910710848491
Published: 25 September 2007
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Journal Articles

A Heuristic Approach to Placement Sequence Identification for SMT

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W. Shin, K. Srihari, J. Adriance, G. Westby
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1993) 5 (2): 20–24.
https://doi.org/10.1108/eb037823
Published: 01 February 1993
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Journal Articles

Knowledge‐based Adhesive Selection for SMT Assemblies

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A. Derebail, K. Srihari, G. Westby
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1992) 4 (2): 13–17.
https://doi.org/10.1108/eb037787
Published: 01 February 1992
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