Skip to Main Content
K.L. Lin
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

Available to Purchase
J. Mittal, K.L. Lin
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (2): 87–95.
https://doi.org/10.1108/SSMT-07-2013-0020
Published: 01 April 2014
View article titled, Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow
Open the PDF for Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow in another window
Add to Citation Manager for Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow
Journal Articles

Activities during melting and reflowing behaviour of solders

Available to Purchase
J. Mittal, K.L. Lin
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (1): 4–10.
https://doi.org/10.1108/09540911011015094
Published: 09 February 2010
View article titled, Activities during melting and reflowing behaviour of solders
Open the PDF for Activities during melting and reflowing behaviour of solders in another window
Add to Citation Manager for Activities during melting and reflowing behaviour of solders
Journal Articles

Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders

Available to Purchase
T.K. Yeh, K.L. Lin, B. Salam
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (4): 19–23.
https://doi.org/10.1108/09540910910989394
Published: 18 September 2009
View article titled, Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders
Open the PDF for Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders in another window
Add to Citation Manager for Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders
Journal Articles

Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders

Available to Purchase
R.S. Lai, K.L. Lin, B. Salam
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (1): 22–26.
https://doi.org/10.1108/09540910810861459
Published: 08 February 2008
View article titled, Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders
Open the PDF for Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders in another window
Add to Citation Manager for Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal