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Journal Articles

Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

J. Mittal, K.L. Lin
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (2): 87–95.
https://doi.org/10.1108/SSMT-07-2013-0020
Published: 01 April 2014
View article titled, Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow
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Journal Articles

Activities during melting and reflowing behaviour of solders

J. Mittal, K.L. Lin
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (1): 4–10.
https://doi.org/10.1108/09540911011015094
Published: 09 February 2010
View article titled, Activities during melting and reflowing behaviour of solders
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Journal Articles

Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders

T.K. Yeh, K.L. Lin, B. Salam
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (4): 19–23.
https://doi.org/10.1108/09540910910989394
Published: 18 September 2009
View article titled, Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders
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Journal Articles

Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders

R.S. Lai, K.L. Lin, B. Salam
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (1): 22–26.
https://doi.org/10.1108/09540910810861459
Published: 08 February 2008
View article titled, Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders
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