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Journal Articles

The Effect of Ageing on the Microstructure of 60:40 Tin‐lead Solders

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P.G. Harris, K.S. Chaggar, M.A. Whitmore
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1991) 3 (1): 20–33.
https://doi.org/10.1108/eb037741
Published: 01 January 1991
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