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Journal Articles

Application of a design of experiments approach to the reliability of a PBGA package

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Ji Hyuck Yang, Kang Yong Lee
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (3): 43–53.
https://doi.org/10.1108/09540910510613547
Published: 01 September 2005
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Journal Articles

Improving the reliability of a plastic IC package in the reflow soldering process by DOE

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Geun Woo Kim, Kang Yong Lee
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (1): 40–48.
https://doi.org/10.1108/09540910510581147
Published: 01 March 2005
View article titled, Improving the reliability of a plastic IC package in the reflow soldering process by DOE
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