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Journal Articles

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Oliver Krammer, Tareq I. Al-Ma’aiteh, Balazs Illes, David Bušek, Karel Dušek

Soldering & Surface Mount Technology (2020) 32 (4): 219–223.

https://doi.org/10.1108/SSMT-11-2019-0037

Published: 01 July 2020

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Journal Articles

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Balázs Illés, Agata Skwarek, Attila Géczy, László Jakab, David Bušek, Karel Dušek

Soldering & Surface Mount Technology (2018) 30 (2): 66–73.

https://doi.org/10.1108/SSMT-09-2017-0025

Published: 01 March 2018

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Journal Articles

New method for determining correction factors for pin-in-paste solder volumes

Oliver Krammer, Bertalan Varga, Karel Dušek

Soldering & Surface Mount Technology (2017) 29 (1): 2–9.

https://doi.org/10.1108/SSMT-11-2016-0032

Published: 06 February 2017

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Journal Articles

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Oliver Krammer, Benjámin Gyarmati, András Szilágyi, Richárd Storcz, László Jakab, Balázs Illés, Attila Géczy, Karel Dušek

Soldering & Surface Mount Technology (2017) 29 (1): 10–14.

https://doi.org/10.1108/SSMT-10-2016-0022

Published: 06 February 2017

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Journal Articles

Corrosion-induced tin whisker growth in electronic devices: a review

Balázs Illés, Barbara Horváth, Attila Géczy, Olivér Krammer, Karel Dušek

Soldering & Surface Mount Technology (2017) 29 (1): 59–68.

https://doi.org/10.1108/SSMT-10-2016-0023

Published: 06 February 2017

View article titled, Corrosion-induced tin whisker growth in electronic devices: a review

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Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

New method for determining correction factors for pin-in-paste solder volumes

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Corrosion-induced tin whisker growth in electronic devices: a review

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