Skip to Main Content
Skip Nav Destination
Oliver Krammer
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Available to Purchase
Oliver Krammer, Tareq I. Al-Ma’aiteh, Balazs Illes, David Bušek, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (4): 219–223.
https://doi.org/10.1108/SSMT-11-2019-0037
Published: 01 July 2020
View article titled, Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing
Open the PDF for Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing in another window
Add to Citation Manager for Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing
Journal Articles

Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

Available to Purchase
Daniel Straubinger, István Bozsóki, Balazs Illes, Oliver Krammer, David Bušek, Attila Geczy
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (4): 247–252.
https://doi.org/10.1108/SSMT-11-2019-0038
Published: 08 April 2020
View article titled, Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
Open the PDF for Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces in another window
Add to Citation Manager for Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
Journal Articles

Non-Newtonian numerical modelling of solder paste viscosity measurement

Available to Purchase
Tareq I. Al-Ma’aiteh, Oliver Krammer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (3): 176–180.
https://doi.org/10.1108/SSMT-11-2018-0044
Published: 31 May 2019
View article titled, Non-Newtonian numerical modelling of solder paste viscosity measurement
Open the PDF for Non-Newtonian numerical modelling of solder paste viscosity measurement in another window
Add to Citation Manager for Non-Newtonian numerical modelling of solder paste viscosity measurement
Journal Articles

Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering

Available to Purchase
Oliver Krammer, Péter Martinek, Balazs Illes, László Jakab
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (3): 163–168.
https://doi.org/10.1108/SSMT-11-2018-0045
Published: 31 May 2019
View article titled, Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering
Open the PDF for Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering in another window
Add to Citation Manager for Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering
Journal Articles

Effects of high current density on lead-free solder joints of chip-size passive SMD components

Available to Purchase
Attila Geczy, Daniel Straubinger, Andras Kovacs, Oliver Krammer, Pavel Mach, Gábor Harsányi
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (2): 74–80.
https://doi.org/10.1108/SSMT-10-2017-0032
Published: 19 February 2018
View article titled, Effects of high current density on lead-free solder joints of chip-size passive SMD components
Open the PDF for Effects of high current density on lead-free solder joints of chip-size passive SMD components in another window
Add to Citation Manager for Effects of high current density on lead-free solder joints of chip-size passive SMD components
Journal Articles

Optimising pin-in-paste technology using gradient boosted decision trees

Available to Purchase
Péter Martinek, Oliver Krammer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (3): 164–170.
https://doi.org/10.1108/SSMT-09-2017-0024
Published: 15 January 2018
View article titled, Optimising pin-in-paste technology using gradient boosted decision trees
Open the PDF for Optimising pin-in-paste technology using gradient boosted decision trees in another window
Add to Citation Manager for Optimising pin-in-paste technology using gradient boosted decision trees
Journal Articles

Investigating the attack angle of squeegees with different geometries

Available to Purchase
Oliver Krammer, László Jakab, Balazs Illes, David Bušek, Ivana Beshajová Pelikánová
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (2): 112–117.
https://doi.org/10.1108/SSMT-09-2017-0023
Published: 18 December 2017
View article titled, Investigating the attack angle of squeegees with different geometries
Open the PDF for Investigating the attack angle of squeegees with different geometries in another window
Add to Citation Manager for Investigating the attack angle of squeegees with different geometries
Journal Articles

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Available to Purchase
Attila Geczy, Daniel Nagy, Balazs Illes, Laszlo Fazekas, Oliver Krammer, David Busek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 34–41.
https://doi.org/10.1108/SSMT-11-2016-0029
Published: 06 February 2017
View article titled, Studying heat transfer on inclined printed circuit boards during vapour phase soldering
Open the PDF for Studying heat transfer on inclined printed circuit boards during vapour phase soldering in another window
Add to Citation Manager for Studying heat transfer on inclined printed circuit boards during vapour phase soldering
Journal Articles

New method for determining correction factors for pin-in-paste solder volumes

Available to Purchase
Oliver Krammer, Bertalan Varga, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 2–9.
https://doi.org/10.1108/SSMT-11-2016-0032
Published: 06 February 2017
View article titled, New method for determining correction factors for pin-in-paste solder volumes
Open the PDF for New method for determining correction factors for pin-in-paste solder volumes in another window
Add to Citation Manager for New method for determining correction factors for pin-in-paste solder volumes
Journal Articles

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Available to Purchase
Oliver Krammer, Benjámin Gyarmati, András Szilágyi, Richárd Storcz, László Jakab, Balázs Illés, Attila Géczy, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 10–14.
https://doi.org/10.1108/SSMT-10-2016-0022
Published: 06 February 2017
View article titled, Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
Open the PDF for Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing in another window
Add to Citation Manager for Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
Journal Articles

Corrosion-induced tin whisker growth in electronic devices: a review

Available to Purchase
Balázs Illés, Barbara Horváth, Attila Géczy, Olivér Krammer, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 59–68.
https://doi.org/10.1108/SSMT-10-2016-0023
Published: 06 February 2017
View article titled, Corrosion-induced tin whisker growth in electronic devices: a review
Open the PDF for Corrosion-induced tin whisker growth in electronic devices: a review in another window
Add to Citation Manager for Corrosion-induced tin whisker growth in electronic devices: a review
Journal Articles

Method for validating CT length measurement of cracks inside solder joints

Available to Purchase
Tamás Garami, Oliver Krammer, Gábor Harsányi, Péter Martinek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (1): 13–17.
https://doi.org/10.1108/SSMT-10-2015-0029
Published: 01 February 2016
View article titled, Method for validating CT length measurement of cracks inside solder joints
Open the PDF for Method for validating CT length measurement of cracks inside solder joints in another window
Add to Citation Manager for Method for validating CT length measurement of cracks inside solder joints
Journal Articles

Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes

Available to Purchase
Balázs Illés, Olivér Krammer, Attila Géczy, Tamás Garami
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (1): 2–6.
https://doi.org/10.1108/SSMT-10-2015-0030
Published: 01 February 2016
View article titled, Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
Open the PDF for Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes in another window
Add to Citation Manager for Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
Journal Articles

Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering

Available to Purchase
Olivér Krammer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (4): 214–222.
https://doi.org/10.1108/SSMT-09-2013-0023
Published: 26 August 2014
View article titled, Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering
Open the PDF for Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering in another window
Add to Citation Manager for Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal