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Journal Articles

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Oliver Krammer, Tareq I. Al-Ma’aiteh, Balazs Illes, David Bušek, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (4): 219–223.
https://doi.org/10.1108/SSMT-11-2019-0037
Published: 01 July 2020
View article titled, Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing
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Journal Articles

Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

Daniel Straubinger, István Bozsóki, Balazs Illes, Oliver Krammer, David Bušek, Attila Geczy
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (4): 247–252.
https://doi.org/10.1108/SSMT-11-2019-0038
Published: 08 April 2020
View article titled, Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
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Journal Articles

Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering

Oliver Krammer, Péter Martinek, Balazs Illes, László Jakab
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (3): 163–168.
https://doi.org/10.1108/SSMT-11-2018-0045
Published: 31 May 2019
View article titled, Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering
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Journal Articles

Non-Newtonian numerical modelling of solder paste viscosity measurement

Tareq I. Al-Ma’aiteh, Oliver Krammer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (3): 176–180.
https://doi.org/10.1108/SSMT-11-2018-0044
Published: 31 May 2019
View article titled, Non-Newtonian numerical modelling of solder paste viscosity measurement
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Journal Articles

Effects of high current density on lead-free solder joints of chip-size passive SMD components

Attila Geczy, Daniel Straubinger, Andras Kovacs, Oliver Krammer, Pavel Mach, Gábor Harsányi
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (2): 74–80.
https://doi.org/10.1108/SSMT-10-2017-0032
Published: 19 February 2018
View article titled, Effects of high current density on lead-free solder joints of chip-size passive SMD components
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Journal Articles

Optimising pin-in-paste technology using gradient boosted decision trees

Péter Martinek, Oliver Krammer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (3): 164–170.
https://doi.org/10.1108/SSMT-09-2017-0024
Published: 15 January 2018
View article titled, Optimising pin-in-paste technology using gradient boosted decision trees
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Journal Articles

Investigating the attack angle of squeegees with different geometries

Oliver Krammer, László Jakab, Balazs Illes, David Bušek, Ivana Beshajová Pelikánová
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (2): 112–117.
https://doi.org/10.1108/SSMT-09-2017-0023
Published: 18 December 2017
View article titled, Investigating the attack angle of squeegees with different geometries
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Journal Articles

Corrosion-induced tin whisker growth in electronic devices: a review

Balázs Illés, Barbara Horváth, Attila Géczy, Olivér Krammer, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 59–68.
https://doi.org/10.1108/SSMT-10-2016-0023
Published: 06 February 2017
View article titled, Corrosion-induced tin whisker growth in electronic devices: a review
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Journal Articles

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Attila Geczy, Daniel Nagy, Balazs Illes, Laszlo Fazekas, Oliver Krammer, David Busek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 34–41.
https://doi.org/10.1108/SSMT-11-2016-0029
Published: 06 February 2017
View article titled, Studying heat transfer on inclined printed circuit boards during vapour phase soldering
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Journal Articles

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Oliver Krammer, Benjámin Gyarmati, András Szilágyi, Richárd Storcz, László Jakab, Balázs Illés, Attila Géczy, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 10–14.
https://doi.org/10.1108/SSMT-10-2016-0022
Published: 06 February 2017
View article titled, Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
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Journal Articles

New method for determining correction factors for pin-in-paste solder volumes

Oliver Krammer, Bertalan Varga, Karel Dušek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 2–9.
https://doi.org/10.1108/SSMT-11-2016-0032
Published: 06 February 2017
View article titled, New method for determining correction factors for pin-in-paste solder volumes
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Journal Articles

Method for validating CT length measurement of cracks inside solder joints

Tamás Garami, Oliver Krammer, Gábor Harsányi, Péter Martinek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (1): 13–17.
https://doi.org/10.1108/SSMT-10-2015-0029
Published: 01 February 2016
View article titled, Method for validating CT length measurement of cracks inside solder joints
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Journal Articles

Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes

Balázs Illés, Olivér Krammer, Attila Géczy, Tamás Garami
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (1): 2–6.
https://doi.org/10.1108/SSMT-10-2015-0030
Published: 01 February 2016
View article titled, Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
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Journal Articles

Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering

Olivér Krammer
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (4): 214–222.
https://doi.org/10.1108/SSMT-09-2013-0023
Published: 26 August 2014
View article titled, Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering
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