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Journal Articles

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

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Muhammad Aamir, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, Vadim V. Silberschmidt
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (2): 115–126.
https://doi.org/10.1108/SSMT-11-2018-0046
Published: 17 October 2019
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Journal Articles

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

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Muhammad Aamir, Majid Tolouei-Rad, Israr Ud Din, Khaled Giasin, Ana Vafadar
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (4): 250–260.
https://doi.org/10.1108/SSMT-01-2019-0001
Published: 25 June 2019
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