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Journal Articles

Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

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Jagjiwan Mittal, Kwang-Lung Lin
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (3): 137–144.
https://doi.org/10.1108/SSMT-10-2017-0035
Published: 13 March 2018
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Journal Articles

A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints

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De‐Shin Liu, Chang‐Lin Hsu, Chia‐Yuan Kuo, Ya‐Ling Huang, Kwang‐Lung Lin, Geng‐Shin Shen
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (1): 22–29.
https://doi.org/10.1108/09540911211198522
Published: 03 February 2012
View article titled, A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints
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