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Journal Articles

Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering

Oliver Krammer, Péter Martinek, Balazs Illes, László Jakab

Soldering & Surface Mount Technology (2019) 31 (3): 163–168.

https://doi.org/10.1108/SSMT-11-2018-0045

Published: 31 May 2019

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Journal Articles

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Balázs Illés, Agata Skwarek, Attila Géczy, László Jakab, David Bušek, Karel Dušek

Soldering & Surface Mount Technology (2018) 30 (2): 66–73.

https://doi.org/10.1108/SSMT-09-2017-0025

Published: 01 March 2018

View article titled, Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

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Journal Articles

Investigating the attack angle of squeegees with different geometries

Oliver Krammer, László Jakab, Balazs Illes, David Bušek, Ivana Beshajová Pelikánová

Soldering & Surface Mount Technology (2018) 30 (2): 112–117.

https://doi.org/10.1108/SSMT-09-2017-0023

Published: 18 December 2017

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Journal Articles

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Oliver Krammer, Benjámin Gyarmati, András Szilágyi, Richárd Storcz, László Jakab, Balázs Illés, Attila Géczy, Karel Dušek

Soldering & Surface Mount Technology (2017) 29 (1): 10–14.

https://doi.org/10.1108/SSMT-10-2016-0022

Published: 06 February 2017

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Journal Articles

X‐ray solder alloy volume measurement (XSVM) in pin‐in‐paste technology (PIP)

Mihály Janóczki, László Jakab

Soldering & Surface Mount Technology (2010) 22 (1): 26–40.

https://doi.org/10.1108/09540911011015120

Published: 09 February 2010

View article titled, X‐ray solder alloy volume measurement (XSVM) in pin‐in‐paste technology (PIP)

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Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Investigating the attack angle of squeegees with different geometries

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

X‐ray solder alloy volume measurement (XSVM) in pin‐in‐paste technology (PIP)

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