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Journal Articles

Reliability analysis of an ACA attached flex-on-board assembly for industrial application

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Janne Kiilunen, Laura Frisk
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (2): 62–70.
https://doi.org/10.1108/SSMT-03-2013-0007
Published: 01 April 2014
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Journal Articles

Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating

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Kati Kokko, Laura Frisk, Pekka Heino
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (3): 42–48.
https://doi.org/10.1108/09540911011054181
Published: 29 June 2010
View article titled, Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating
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Journal Articles

Effect of substrate material and thickness on reliability of ACA bonded flip chip joints

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Laura Frisk, Anne Cumini
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (3): 16–23.
https://doi.org/10.1108/09540910910970376
Published: 26 June 2009
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Journal Articles

Reliability of ACA bonded flip chip joints on LCP and PI substrates

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Laura Frisk, Anne Cumini
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (4): 12–20.
https://doi.org/10.1108/09540910610717866
Published: 01 October 2006
View article titled, Reliability of ACA bonded flip chip joints on LCP and PI substrates
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Journal Articles

The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

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Laura Frisk, Kati Kokko
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (4): 28–37.
https://doi.org/10.1108/09540910610717884
Published: 01 October 2006
View article titled, The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints
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