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Journal Articles

The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process

Li‐li Gao, Song‐bai Xue, Hong Zhu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (3): 216–222.
https://doi.org/10.1108/09540911211240083
Published: 22 June 2012
View article titled, The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process
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Journal Articles

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Peng Xue, Song‐bai Xue, Liang Zhang, Yi‐fu Shen, Li‐li Gao, Sheng‐lin Yu, Hong Zhu, Zongjie Han, Yan Chen
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 177–183.
https://doi.org/10.1108/09540911111146935
Published: 28 June 2011
View article titled, Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering
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Journal Articles

Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

Liang Zhang, Song‐bai Xue, Li‐li Gao, Zhong Sheng, Wei Dai, Feng Ji, Huan Ye, Yan Chen, Sheng‐lin Yu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (1): 4–9.
https://doi.org/10.1108/09540911111099640
Published: 08 February 2011
View article titled, Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints
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Journal Articles

Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

Liang Zhang, Song-bai Xue, Li-li Gao, Yan Chen, Sheng-lin Yu, Zhong Sheng, Guang Zeng
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (2): 30–36.
https://doi.org/10.1108/09540911011036262
Published: 13 April 2010
View article titled, Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
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