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Journal Articles

The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process

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Li‐li Gao, Song‐bai Xue, Hong Zhu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (3): 216–222.
https://doi.org/10.1108/09540911211240083
Published: 22 June 2012
View article titled, The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process
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Journal Articles

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

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Peng Xue, Song‐bai Xue, Liang Zhang, Yi‐fu Shen, Li‐li Gao, Sheng‐lin Yu, Hong Zhu, Zongjie Han, Yan Chen
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 177–183.
https://doi.org/10.1108/09540911111146935
Published: 28 June 2011
View article titled, Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering
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Journal Articles

Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

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Liang Zhang, Song‐bai Xue, Li‐li Gao, Zhong Sheng, Wei Dai, Feng Ji, Huan Ye, Yan Chen, Sheng‐lin Yu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (1): 4–9.
https://doi.org/10.1108/09540911111099640
Published: 08 February 2011
View article titled, Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints
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Journal Articles

Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

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Liang Zhang, Song-bai Xue, Li-li Gao, Yan Chen, Sheng-lin Yu, Zhong Sheng, Guang Zeng
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (2): 30–36.
https://doi.org/10.1108/09540911011036262
Published: 13 April 2010
View article titled, Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
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