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Journal Articles

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

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Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Kusý, Matej Pašák
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 93–101.
https://doi.org/10.1108/SSMT-10-2018-0039
Published: 02 April 2019
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