Page 1 | Search Results | Soldering & Surface Mount Technology | Emerald Publishing

Skip to Main Content

1-3 of 3

Sort by

Sort Order Select

Journal Articles

Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment

Mei-Ling Wu, Jia-Shen Lan

Soldering & Surface Mount Technology (2017) 29 (2): 75–84.

https://doi.org/10.1108/SSMT-06-2016-0012

Published: 03 April 2017

View article titled, Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment

Add to Citation Manager for Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment

Journal Articles

Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via

Mei-Ling Wu, Jia-Shen Lan

Soldering & Surface Mount Technology (2016) 28 (4): 177–187.

https://doi.org/10.1108/SSMT-04-2016-0008

Published: 05 September 2016

View article titled, Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via

Add to Citation Manager for Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via

Journal Articles

Microelectronic packaging reliability using the RSM technique

Soldering & Surface Mount Technology (2010) 22 (2): 3–12.

https://doi.org/10.1108/09540911011036235

Published: 13 April 2010

View article titled, Microelectronic packaging reliability using the RSM technique

Add to Citation Manager for Microelectronic packaging reliability using the RSM technique