Skip to Main Content
Muhammad Taufik Azahari
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process

Available to Purchase
Calvin Ling, Aizat Abas, Cheng Kai Chew, Muhammad Taufik Azahari
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (5): 364–376.
https://doi.org/10.1108/SSMT-11-2024-0070
Published: 19 June 2025
View article titled, Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process
Open the PDF for Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process in another window
Add to Citation Manager for Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process
Journal Articles

Deep learning and analytical study of void regional formation in flip-chip underfilling process

Available to Purchase
Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (1): 60–68.
https://doi.org/10.1108/SSMT-06-2023-0028
Published: 24 October 2023
View article titled, Deep learning and analytical study of void regional formation in flip-chip underfilling process
Open the PDF for Deep learning and analytical study of void regional formation in flip-chip underfilling process in another window
Add to Citation Manager for Deep learning and analytical study of void regional formation in flip-chip underfilling process
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal