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Journal Articles

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

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Z.W. Zhong, P. Arulvanan, Hla Phone Maw, C.W.A. Lu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2007) 19 (4): 18–24.
https://doi.org/10.1108/09540910710848518
Published: 25 September 2007
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Journal Articles

Lead‐free PCB assembly and effects of process conditions on the profile and reliability of solder joints

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Z.W. Zhong, P. Arulvanan, X.Q. Shi
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (4): 33–37.
https://doi.org/10.1108/09540910510630412
Published: 01 December 2005
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