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Journal Articles

Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process

Xu Han, Xiaoyan Li, Peng Yao

Soldering & Surface Mount Technology (2022) 34 (2): 79–87.

https://doi.org/10.1108/SSMT-06-2021-0034

Published: 12 August 2021

View article titled, Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process

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Journal Articles

Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints

Xu Han, Xiaoyan Li, Peng Yao, Dalong Chen

Soldering & Surface Mount Technology (2021) 33 (4): 206–214.

https://doi.org/10.1108/SSMT-06-2020-0026

Published: 25 January 2021

View article titled, Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints

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Journal Articles

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu₃Sn proportion and joints with conventional interfacial structure in electronic packaging

Peng Yao, Xiaoyan Li, Xu Han, Liufeng Xu

Soldering & Surface Mount Technology (2019) 31 (1): 6–19.

https://doi.org/10.1108/SSMT-06-2018-0018

Published: 18 February 2019

View article titled, Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging

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Journal Articles

The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints

Li Yang, Li Xiaoyan, Peng Yao

Soldering & Surface Mount Technology (2019) 31 (1): 28–39.

https://doi.org/10.1108/SSMT-03-2018-0010

Published: 18 February 2019

View article titled, The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints

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Journal Articles

Morphology transformation on Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging

Peng Yao, Xiaoyan Li, Fengyang Jin, Yang Li

Soldering & Surface Mount Technology (2018) 30 (1): 14–25.

https://doi.org/10.1108/SSMT-10-2017-0038

Published: 16 January 2018

View article titled, Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

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Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process

Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu₃Sn proportion and joints with conventional interfacial structure in electronic packaging

The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints

Morphology transformation on Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging

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