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Journal Articles

Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly

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Yan Pan, Shuye Zhang, Pengli Zhu, Kyung W. Paik
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (5): 253–259.
https://doi.org/10.1108/SSMT-08-2023-0048
Published: 08 August 2024
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Journal Articles

A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics

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Yan Pan, Taiyu Jin, Xiaohui Peng, Pengli Zhu, Kyung W. Paik
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (2): 173–179.
https://doi.org/10.1108/SSMT-11-2023-0066
Published: 02 May 2024
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