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S.W. Ricky Lee
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Journal Articles
Reliability study of surface mount printed circuit board assemblies with lead‐free solder joints
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 30–38.
Published: 11 April 2008
Journal Articles
Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 21–26.
Published: 01 August 2004
Journal Articles
Analysis on solder ball shear testing conditions with a simple computational model
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (1): 45–48.
Published: 01 April 2002
