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Journal Articles

Realistic warpage evaluation of printed board assembly during reflow process

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Soonwan Chung, Jae B. Kwak
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (4): 137–145.
https://doi.org/10.1108/SSMT-12-2014-0023
Published: 07 September 2015
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Journal Articles

Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects

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Jae B. Kwak, Soonwan Chung
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (1): 1–6.
https://doi.org/10.1108/SSMT-03-2014-0008
Published: 02 February 2015
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