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Journal Articles
The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths
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Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (3): 4–10.
Published: 27 June 2008
