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Journal Articles

Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder

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C. Kanchanomai, Y. Miyashita, Y. Mutoh, S.L. Mannan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (3): 30–36.
https://doi.org/10.1108/09540910210444700
Published: 01 December 2002
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Journal Articles

Fatigue crack growth behaviour of lead‐containing and lead‐free solders

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Y. Mutoh, J. Zhao, Y. Miyashita, C. Kanchanomai
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (3): 37–45.
https://doi.org/10.1108/09540910210444719
Published: 01 December 2002
View article titled, Fatigue crack growth behaviour of lead‐containing and lead‐free solders
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