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Journal Articles

Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints

Wei Liu, Rong An, Chunqing Wang, Yanhong Tian

Soldering & Surface Mount Technology (2015) 27 (1): 45–51.

https://doi.org/10.1108/SSMT-07-2014-0016

Published: 02 February 2015

View article titled, Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints

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Journal Articles

Oxidation and Au‐Sn reaction of laser reflowed micro‐solder joints protected by N2 or exposed to air atmosphere

Wei Liu, Yanhong Tian, Lei Yang, Chunqing Wang, Lining Sun

Soldering & Surface Mount Technology (2012) 24 (3): 191–196.

https://doi.org/10.1108/09540911211240056

Published: 22 June 2012

View article titled, Oxidation and Au‐Sn reaction of laser reflowed micro‐solder joints protected by N2 or exposed to air atmosphere

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Journal Articles

Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping

Yanhong Tian, Chunqing Wang, Xiaodong Zhang, Deming Liu

Soldering & Surface Mount Technology (2003) 15 (2): 17–21.

https://doi.org/10.1108/09540910310479693

Published: 01 August 2003

View article titled, Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping

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