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Journal Articles

Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

Jibing Chen, Yanfang Yin, Jianping Ye, Yiping Wu

Soldering & Surface Mount Technology (2015) 27 (2): 76–83.

https://doi.org/10.1108/SSMT-05-2014-0010

Published: 07 April 2015

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Journal Articles

Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand‐off heights

Bo Wang, Fengshun Wu, Yiping Wu, Liping Mo, Weisheng Xia

Soldering & Surface Mount Technology (2011) 23 (4): 229–234.

https://doi.org/10.1108/09540911111169075

Published: 20 September 2011

View article titled, Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand‐off heights

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Journal Articles

A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints

Bo Wang, Fengshun Wu, Yiping Wu, Bing An, Hui Liu, Jian Zou

Soldering & Surface Mount Technology (2011) 23 (1): 40–46.

https://doi.org/10.1108/09540911111099695

Published: 08 February 2011

View article titled, A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints

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Journal Articles

Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints

Bo Wang, Fengshun Wu, Yiping Wu, Hui Liu, Longzao Zhou, Yuebo Fang

Soldering & Surface Mount Technology (2010) 22 (1): 11–18.

https://doi.org/10.1108/09540911011015102

Published: 09 February 2010

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Journal Articles

Optimization of a reflow soldering process based on the heating factor

JinGang Gao, YiPing Wu, Han Ding

Soldering & Surface Mount Technology (2007) 19 (1): 28–33.

https://doi.org/10.1108/09540910710748131

Published: 13 February 2007

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Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand‐off heights

A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints

Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints

Optimization of a reflow soldering process based on the heating factor

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