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Journal Articles

Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging

Xinmeng Zhai, Yue Chen, Yuefeng Li, Jun Zou, Mingming Shi, Bobo Yang

Soldering & Surface Mount Technology (2022) 34 (5): 257–265.

https://doi.org/10.1108/SSMT-08-2021-0059

Published: 15 February 2022

View article titled, Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging

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Journal Articles

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

Xinmeng Zhai, Yue Chen, Yuefeng Li

Soldering & Surface Mount Technology (2022) 34 (3): 174–182.

https://doi.org/10.1108/SSMT-09-2021-0062

Published: 09 November 2021

View article titled, Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

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Journal Articles

Effect of different soldering temperatures on the properties of COB light source

Zhao Wang, Yuefeng Li, Jun Zou, Bobo Yang, Mingming Shi

Soldering & Surface Mount Technology (2022) 34 (2): 88–95.

https://doi.org/10.1108/SSMT-03-2021-0010

Published: 28 August 2021

View article titled, Effect of different soldering temperatures on the properties of COB light source

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