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Journal Articles

Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys

Jiacheng Zhou, Jinglin Shi, Dongfan Yin, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun He

Soldering & Surface Mount Technology (2025) 37 (3): 194–204.

https://doi.org/10.1108/SSMT-11-2024-0068

Published: 24 December 2024

View article titled, Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys

Add to Citation Manager for Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys

Journal Articles

Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate

Jiacheng Zhou, Jinglin Shi, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun He

Soldering & Surface Mount Technology (2024) 36 (5): 276–284.

https://doi.org/10.1108/SSMT-03-2024-0013

Published: 13 August 2024

View article titled, Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate

Add to Citation Manager for Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate

Includes: Supplementary data