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Zhijie Zhang
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Journal Articles
Electromigration-induced diffusion behavior of Zn and abnormal intermetallic growth in Cu/Sn-9Zn/Cu(Ni) interconnects
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (5): 342–352.
Published: 05 May 2025
