...Yang Liu; Yuxiong Xue; Min Zhou; Rongxing Cao; Xianghua Zeng; Hongxia Li; Shu Zheng; Shuang Zhang Purpose The purpose of this paper is to investigate the effects of Sn-Ag-x leveling layers on the mechanical properties of SnBi solder joints. Four Sn-Ag-x (Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag...

...Zhen Pan; Fenglian Sun Purpose The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property...

...Hardinnawirda Kahar; Zetty Akhtar Abd Malek; Siti Rabiatull Aisha Idris; Mahadzir Ishak Purpose This paper aims to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area...

...Dr Agata Skwarek; Agata Skwarek; Beata Synkiewicz; Jan Kulawik; Piotr Guzdek; Krzysztof Witek; Jacek Tarasiuk Purpose – The purpose of this paper is to assess the reliability of thermoelectric generators after ageing at elevated temperature and to determine the influence of the technology used...

...Huan Wang; Yongchang Liu; Huixia Gao; Zhiming Gao Purpose – This paper aims to investigate the transformations during aging at 200°C for different periods on microstructure and mechanical properties of high-temperature Zn-4Al-3Mg solders. Design/methodology/approach – The solder was melted...