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Keywords: BGA
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (3): 162–173.
Published: 27 October 2021
...Yanruoyue Li; Guicui Fu; Bo Wan; Zhaoxi Wu; Xiaojun Yan; Weifang Zhang Purpose The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (1)
Published: 01 April 2001
... IPC Reliability BGA IPC IPC-7095 focuses on BGA reliability issues Keywords: IPC, Reliability, BGA PC have announced the release of IPC-7095, Design and Assembly Process Implementation for BGAs. This document describes the design and assembly challenges...
