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Keywords: BGA package
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (4): 308–319.
Published: 02 April 2025
... In this paper, a three-dimensional finite element model of board-level ball grid array (BGA) package structure is established, and numerical calculations are performed based on thermal-drop impact load sequence coupling. The effects of chip thickness, solder ball height, diameter and array on its temperature...
