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Journal Articles

Reliability analysis of TSV silicon perforated structures under thermal cyclic loading

Xuexia Yang, Miao Zhu, Jinming Li, Yanxi Sun, Chao Chang, Xin Hao

Soldering & Surface Mount Technology (2026) 38 (1): 50–60.

https://doi.org/10.1108/SSMT-04-2025-0020

Published: 02 September 2025

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Journal Articles

Reliability analysis based on modeling of POP packages under thermal-drop impact loads

Xuexia Yang, Yanxi Sun, Miao Zhu, Chao Wang, Erqiang Liu, Gesheng Xiao

Soldering & Surface Mount Technology (2025) 37 (5): 386–396.

https://doi.org/10.1108/SSMT-03-2025-0012

Published: 24 June 2025

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Journal Articles

Reliability analysis and parameter optimisation of board-level BGA packaging structures under thermal-drop impact load

Yanxi Sun, Zixin Zhen, Xuexia Yang, Miao Zhu, Chao Chang

Soldering & Surface Mount Technology (2025) 37 (4): 308–319.

https://doi.org/10.1108/SSMT-01-2025-0003

Published: 02 April 2025

View article titled, Reliability analysis and parameter optimisation of board-level BGA packaging structures under thermal-drop impact load

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