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Keywords: BGA packaging
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (3): 170–177.
Published: 11 November 2020
... test and simulation ”, The Journal of Electronic Packaging , Vol. 130 No. 2 , pp. 21006 - 21007 . Liu , F. , Lu , Y. , Wang , Z. and Zhang , Z. (2015), “ Numerical simulation and fatigue life estimation of BGA packages under random vibration loading ”, Microelectronics...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (3): 147–156.
Published: 04 February 2020
... provides reliable insights to the effect of hourglass shape BGA on the encapsulation process that will benefit future development of BGA packages. Originality/value LBM numerical method was implemented in this research to study the flow behaviour of an encapsulation process in term of filling time...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 75–84.
Published: 03 April 2017
... of the analytical model developed as a part of this current work is presented. Its main advantage is its ability to calculate the normal stress on the outermost solder joint by controlling the silicon chip length, for any type of BGA packages. The purpose of this study was to investigate the changes...
