Keywords: Bonding strength
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Journal Articles
Soldering & Surface Mount Technology 1–8.
Published: 22 January 2026
... and strain distribution were systematically characterized using confocal laser scanning microscopy ( CLSM ), focused ion beam ( FIB ), transmission Kikuchi diffraction ( TKD ) and geometric phase analysis ( GPA ) via transmission electron microscopy. Interfacial bonding strength was evaluated by shear tests...
Journal Articles
Soldering & Surface Mount Technology (2024) 36 (1): 39–50.
Published: 13 September 2023
...Bifu Xiong; Siliang He; Jinguo Ge; Quantong Li; Chuan Hu; Haidong Yan; Yu-An Shen Purpose This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase...
Includes: Supplementary data

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