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Keywords: Composition
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Journal Articles
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (3): 183–190.
Published: 02 December 2021
...Guang Chen; Yao-Feng Wu Purpose The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large temperature gradient. Design/methodology/approach In this paper, SAC305 lead-free...
