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Journal Articles

Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing

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Guang Chen, Yao-Feng Wu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (3): 183–190.
https://doi.org/10.1108/SSMT-08-2021-0058
Published: 02 December 2021
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Journal Articles

Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing

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Guang Chen, Xinzhan Cui, Yaofeng Wu, Wei Li, Fengshun Wu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (1): 35–46.
https://doi.org/10.1108/SSMT-02-2020-0004
Published: 11 June 2020
View article titled, Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing
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Journal Articles

The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing

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Guang Chen, Jiqiang Li, Xinwen Kuang, Yaofeng Wu, Fengshun Wu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (4): 261–270.
https://doi.org/10.1108/SSMT-11-2018-0043
Published: 25 June 2019
View article titled, The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing
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Journal Articles

Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle

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Guang Chen, Li Liu, Vadim V. Silberschmidt, Y.C. Chan, Changqing Liu, Fengshun Wu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (3): 159–166.
https://doi.org/10.1108/SSMT-02-2016-0004
Published: 06 June 2016
View article titled, Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle
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Journal Articles

An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder

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Guang Chen, Bomin Huang, Hui Liu, Y.C. Chan, Zirong Tang, Fengshun Wu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (2): 84–92.
https://doi.org/10.1108/SSMT-08-2015-0027
Published: 04 April 2016
View article titled, An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder
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