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Journal Articles

Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing

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Guang Chen, Xinzhan Cui, Yaofeng Wu, Wei Li, Fengshun Wu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (1): 35–46.
https://doi.org/10.1108/SSMT-02-2020-0004
Published: 11 June 2020
View article titled, Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing
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Journal Articles

The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing

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Guang Chen, Jiqiang Li, Xinwen Kuang, Yaofeng Wu, Fengshun Wu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (4): 261–270.
https://doi.org/10.1108/SSMT-11-2018-0043
Published: 25 June 2019
View article titled, The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing
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