Page 1 | Search Results | Soldering & Surface Mount Technology | Emerald Publishing

1-2 of 2

Sort by

Journal Articles

Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling

Li Liu, Chunhua Zhang, Ping Hu, Sheng Liu, Zhiwen Chen

Soldering & Surface Mount Technology (2025) 37 (2): 117–126.

https://doi.org/10.1108/SSMT-10-2023-0059

Published: 18 March 2024

View article titled, Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling

Add to Citation Manager for Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling

Journal Articles

Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle

Guang Chen, Li Liu, Vadim V. Silberschmidt, Y.C. Chan, Changqing Liu, Fengshun Wu

Soldering & Surface Mount Technology (2016) 28 (3): 159–166.

https://doi.org/10.1108/SSMT-02-2016-0004

Published: 06 June 2016

View article titled, Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle

Add to Citation Manager for Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle