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Keywords: Current carrying capability
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Journal Articles
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly
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Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (5): 253–259.
Published: 08 August 2024
...Yan Pan; Shuye Zhang; Pengli Zhu; Kyung W. Paik Purpose The study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By comparing Sn58Bi and SAC305 particles and varying substrate widths...
