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Keywords: Diffusion
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Journal Articles
Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (3): 137–144.
Published: 13 March 2018
...Jagjiwan Mittal; Kwang-Lung Lin Purpose This paper aims to study the diffusion of Zn, Ni and Sn in the liquid state during the reflow ageing of the Sn-Zn solder above its melting point on an Ni/Cu substrate in relation to the formation of intermetallic compounds (IMCs). Design/methodology...
Journal Articles
On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (4): 24–31.
Published: 18 September 2009
... Group Publishing Limited 2009 Solders Soldering Copper Alloys Diffusion During soldering there is a reaction between the solder and the metallisation of the substrate. The dissolution process starts with the diffusion of Cu into the solder. As copper dissolves, the liquidus...
Journal Articles
Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (1): 13–21.
Published: 08 February 2008
.... Findings Dynamic recrystallisation of the tin matrix leads to a change in the diffusion controlled growth mechanism, which causes an increase of the particle growth rate compared to isothermal storage. Thus, these grain boundaries are separated forcibly by crack growth during thermal cycling. This stress...
