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Keywords: Dispensing orientations
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (5): 364–376.
Published: 19 June 2025
...Calvin Ling; Aizat Abas; Cheng Kai Chew; Muhammad Taufik Azahari Purpose This study aims to develop an empirical model to elucidate the void size formed during an underfilling process of asymmetrical ball grid array flip-chip of I, L and U dispensing orientation with various parameters. Design...
