...Soufyane Belhenini; Imad El Fatmi; Caroline Richard; Abdellah Tougui Purpose This study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is based on the introduction of non-linear...

... analysis were performed in order to study the failure mechanism of lead‐free solder joint under drop impact. Findings The test results indicate that the combined effect of mechanical shock and PCB bending vibration is the root cause of solder joint failure under drop impact, and that the maximum...