... © MCB UP Limited 1999 --> IEEE Electronics packaging The Second International IEEE Symposium on Polymeric Electronics Packaging (PEP'99) Keywords IEEE, Electronics packaging 24-28 October 1999, Göteborg, SwedenVenue: Hotel Sheraton Announcement and call...

...John H. Lau; Chris Chang Most of the electronics packaging materials, especially solders, are temperature dependent. Their temperature‐dependent material properties can be obtained by TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimetry...

... ceramics in hermetic, high power packages, and MCM/ hybrid modules. Thermally enhanced plastic packages more frequently feature heat sinks embedded in the package for direct attachment of the power devices. Today's challenge in electronic packaging is to dissipate the heat from the source, the device...

... and their economics. The case histories encompass printed circuit board assembly (including surface mount), electronics packaging and microelectronic encapsulation. Production managers and process engineers are given confidence that practical adhesive application can be clean, fast and economical. It is well known...