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Keywords: Filamentous Ag3Sn
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (4): 173–179.
Published: 26 August 2014
... joints, there were tiny filamentous Ag3Sn growing on the surface of interfacial Cu6Sn5 grains, and the Ag3Sn had a tendency to break into nanoparticles, which would be distributed evenly and cover the IMC layer, profiting from the Bi and Cr precipitates from solder matrix during ageing. Originality...
