... Publishing Limited Licensed re-use rights only Electromigration Cu–Cu hybrid bonding Multiphysics simulation Atomic flux divergence method Finite element method National Key R&D Program of China 2024YFF0504900 National Natural Science Foundation of China Grant No. 92373204...

... electrical–thermal–structural analysis of flip chip ball grid array (FCBGA) using the finite element method (FEM). The atomic density integration method was used to simulate the location of void formation in FCBGA, and the influence of solder material and copper metal layer structure on solder joint...

...-mechanical coupling method that used finite-element method software (ANSYS 13.1) was performed. Meanwhile, a shadow moiré apparatus (TherMoiré PS200) combined with a heating platform was used for the experimental measurement of the warpage of PBGA according to the JEDEC Standard. Findings – The authors...

... (CFD) software (FLUENT 6.3.26) while the structural heating BGA package simulation was done using finite element method (FEM) software (ABAQUS 6.9). Both software applications were coupled bi‐directionally using the code coupling software MpCCI. Findings The convective heat transfer coefficient...

... element method Bond parameter Material properties Nanoindentation Electronic control devices are exposed to large thermal and mechanical loads during operation. With regards to faster development cycles, electronic packaging and interconnection technology must be designed taking...

.... Thermal testing Finite element method Fatigue © MCB UP Limited 2002 The use of accelerated tests to characterize the reliability of electronic packages is well established at the present time in the microelectronics industry. The widely prevalent accelerated life test at the present time...

... combined with accelerated stress testing proved to be an effective tool for test result analysis and for rationalising the test sequences. © MCB UP Limited 2000 Finite element method Reliability Tape ball grid array Electronic systems, including telecom equipment, are becoming highly...

... . The calculated parameters in the Weibull distribution were summarized in Table I . It is obvious that underfill A is the most reliable, while underfill C is the worst in the thermal cycling test. Flip chip on board Underfill Reliability Finite element method Delamination Crack propagation...