...Calvin Ling; Aizat Abas; Cheng Kai Chew; Muhammad Taufik Azahari Purpose This study aims to develop an empirical model to elucidate the void size formed during an underfilling process of asymmetrical ball grid array flip-chip of I, L and U dispensing orientation with various parameters. Design...

...Calvin Ling; Cheng Kai Chew; Aizat Abas; Taufik Azahari Purpose This paper aims to identify a suitable convolutional neural network (CNN) model to analyse where void(s) are formed in asymmetrical flip-chips with large amounts of the ball-grid array (BGA) during underfilling. Design/methodology...

...Calvin Ling; Muhammad Taufik Azahari; Mohamad Aizat Abas; Fei Chong Ng Purpose This paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region. Design/methodology/approach A set of top-down scanning acoustic...

...Fei Chong Ng; Aizat Abas; Muhammad Naqib Nashrudin; M. Yusuf Tura Ali Purpose This paper aims to study the filling progression of underfill flow and void formation during the flip-chip encapsulation process. Design/methodology/approach A new parameter of filling progression that relates volume...

...Muhammad Naqib Nashrudin; Zhong Li Gan; Aizat Abas; M.H.H. Ishak; M. Yusuf Tura Ali Purpose In line with the recent development of flip-chip reliability and underfill process, this paper aims to comprehensively investigate the effect of different hourglass shape solder joint on underfill...

...Fei Chong Ng; Mohamad Aizat Abas; Mohd Zulkifly Abdullah Purpose This paper aims to introduce a new indicative parameter of filling efficiency to quantify the performance and productivity of the flip-chip underfill encapsulation process. Additionally, the variation effect of the bump pitch of flip...

... die. Bump stamps on the bottom die after the shear test (Figure 7) were approximately 3-4 µm in height. Figure 6 SEM images of bump stamps on the top and bottom dies after the shear strength tests Flip-chips Microstructure SAM Shear strength Interconnects Direct-bond-copper (DBC...

...Ye Tian; Justin Chow; Xi Liu; Suresh K. Sitaraman Purpose – The purpose of this paper is to study the intermetallic compound (IMC) thickness, composition and morphology in 100-μm pitch and 200-μm pitch Sn–Ag–Cu (SAC305) flip-chip assemblies after bump reflow and assembly reflow. In particular...

... the development of ACF joints using fine pitch flip chip on substrate with better reliability and performance. In practical conditions, the bonding interface interconnected by an ACF in electrical components is always subjected to temperature fluctuations, which may lead to tensile, compressive and shearing...

...Si Chen Purpose The transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA) materials. Design/methodology/approach The structure of CNFs was confirmed by transmission electron...