... by the particle/liquid solder interface to a greater extent. A similar phenomenon could operate in the case of Zn nanoparticles as well. However, further investigation is necessary to confirm this. Solder Flow Nanocomposite solder Reflow Intermetallic compounds Zn nanoparticles Copper...

...Y.S. Lin; W.J. Lin; L.Y. Chiu Purpose The purpose of this paper is to investigate the effects of H2 flow rate on improving the solder wettability of oxidized‐copper with liquid lead‐free solder (96.5Sn‐3Ag‐0.5Cu) by Ar‐H2 plasmas. The aim was to improve the solder wettability of oxidized copper...

... method software (ABAQUS 6.9). Findings The simulation showed a complex flow pattern having characteristics of a free‐jet region, stagnation‐flow region, wall jet‐region, recirculation region and vortices. A sharp maximum heat‐transfer coefficient was detected in the stagnation region...

... mechanism analysis. These methods involve a large number of experiments which are not cost effective. Flow Soldering Convection Forced convection reflow Computational fluid dynamics Finite element method Thermal coupling method Ball grid array assembly A=Heated area of the PCB...

... be contacted at: siva@iitm.ac.in © Emerald Group Publishing Limited 2012 Soldering Flow Deformation Stress (materials) Flip‐chip Reflow Ball grid array Residual stresses Residual warpage Flip‐chip microelectronic assembly is the direct electrical connection of face down (flipped...

... Flow Soldering has been commonly employed in the electronics industry for metal bonding in microelectronic assemblies. Up to last decade, Sn‐Pb was generally used because of its various advantages including low melting point, low cost and good wettability (Jin, 1993). However, world‐wide...

...N. Saxena; C. Precious; A. Carr; S. Adams Well designed stable reflow ovens and wave machines can be operated at low rates of the inerting gas. One problem is that at the lowest flow rate settings changes in room draughts and in external venting conditions can affect the internal oxygen levels...

...P.T. Vianco; J.A. Rejent A test procedure was developed to assess the capillary flow wettability of solders inside a confined geometry. The test geometry comprised two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm and 0.038 cm). Capillary flow...