...Guangcheng Dong; Xu Chen; Xinjian Zhang; Khai D.T. Ngo; Guo-Quan Lu Purpose The purpose of this paper is to study the phenomenology of Al₂O₃-DBC substrate thermal-cracking under different high temperature cyclic loadings. The extremely low cycle fatigue (ELCF) life prediction...

.... Copper High temperatures Fatigue Substrates Thermal properties of materials Packaging Direct‐bond‐copper (DBC) substrates have been used in electronics packaging for several years and research on material properties has been conducted. Previous studies have looked at the stresses that exist...

..., etc. the high‐temperature brazing materials are not suitable for Al‐based composites anymore. This raises a demand on solder materials with melting temperature at 400‐500°C. However, the solder alloys with melting temperature in 400‐500°C are still relatively lack. The goal is obvious – to seek...